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XC161CS-32F Datasheet(PDF) 83 Page - Infineon Technologies AG |
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XC161CS-32F Datasheet(HTML) 83 Page - Infineon Technologies AG |
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83 / 84 page ![]() XC161-32 Derivatives Packaging Data Sheet 81 V1.0, 2004-11 5 Packaging Package Outlines Figure 25 P-TQFP-144-19 (Plastic Thin Quad Flat Package) Table 22 Package Parameters (P-TQFP-144-19) Parameter Symbol Limit Values Unit Notes Min. Max. Power dissipation P DISS –0.8 W – Thermal resistance R THA – 32 K/W Chip-Ambient GPP09243 1) 2) 144x H 4x Index Marking 144 1 ±0.05 A 0.22 0.5 22 20 D 1) 17.5 0.08 2) A-B M D 0.2 0.2 B A-B A-B D D H 144x C C 0.08 0.6 ±0.15 Does not include plastic or metal protrusion of 0.25 max. per side Does not include dambar protrusion of 0.08 max. per side You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Dimensions in mm |
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