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AD5693 Datasheet(PDF) 23 Page - Analog Devices |
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AD5693 Datasheet(HTML) 23 Page - Analog Devices |
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23 / 26 page ![]() Data Sheet AD5693R/AD5692R/AD5691R/AD5693 Rev. D | Page 23 of 26 LOAD DAC (HARDWARE LDAC PIN) The AD5693R/AD5692R/AD5691R/AD5693 DAC has a double buffered interface consisting of an input register and a DAC register. The LDAC pin transfers data from the input register to the DAC register, and the output is updated. Synchronous DAC Update If the LDAC pin is held low while the input register is written, the DAC register, input register, and output are updated on the last SCL falling edge before the ACK bit, as shown in Figure 4. Asynchronous DAC Update LDAC is held high while data is transmitted to the device. The DAC output is updated by taking LDAC low after the stop condition has been generated. The output DAC is updated on the falling edge of the LDAC pin. If LDAC is pulsed while the device is accessed, the pulse is ignored. HARDWARE RESET RESET is an active low signal that resets the DAC output to zero- scale and sets the input, DAC, and control registers to their default values. It is necessary to keep RESET low for 75 ns to complete the operation. When the RESET signal is returned high, the output remains at zero scale until a new value is programmed. While the RESET pin is low, the AD5693R/AD5692R/AD5691R/ AD5693 ignore any new command. If the RESET pin is held low at power-up, the internal reference is not initialized correctly until the RESET pin is released. THERMAL HYSTERESIS Thermal hysteresis is the voltage difference induced on the reference voltage by sweeping the temperature from ambient to cold, to hot, and then back to ambient. The thermal hysteresis data is shown in Figure 50. It is measured by sweeping the temperature from ambient to −40°C, then to +105°C, and finally returning to ambient. The VREF delta is measured between the two ambient measurements; the result is shown in solid lines in Figure 50. The same temperature sweep and measurements were immediately repeated; the results are shown in dashed lines in Figure 50. 6 4 5 3 2 1 0 –100 60 20 –20 –60 40 0 –40 –80 DISTORTION (ppm) FIRST TEMPERATURE SWEEP SUBSEQUENT SWEEPS Figure 50. Thermal Hysteresis POWER-UP SEQUENCE Because diodes limit the voltage compliance at the digital pins and analog pins, it is important to power GND first before applying any voltage to VDD, VOUT, and VLOGIC. Otherwise, the diode is forward-biased such that VDD is powered uninten- tionally. The ideal power-up sequence is GND, VDD, VLOGIC, VREF, followed by the digital inputs. |
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