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TM8705
3
tenx technology, inc.
Rev 1.3
03/12/01
BLOCK DIAGRAM
PAD DIAGRAM
The substrate of chip should be connected to GND.
OSCILLATOR
CONTROL
CIRCUIT
12 BITS PROGRAM
COUNTER
PROGRAM ROM
(1024+128N)
X 16 BITS
DATA RAM
512 X 4 BITS
8 LEVELS
STACK
6 BITS PRESET
TIMER 1 & 2
PRE-
DIVIDER
INSTRUCTION
DECODER
ALU
INDEX ROM
256(16-N) X 8 BITS
FREQUENCY
GENERATOR
B-PORT
EL DRIVER
ALARM
A-PORT
RFC
C-PORT
KEY-IN
SEGMENT PLA
LCD DRIVER
VDD1-3
COM1-6
SEG1-40
C1-4
A1-4
B1-4
XTIN,OUT
CUP0,1
RESET INT
4 BITS DATA BUS
TM8705 BLOCK DIAGRAM
N:0->16
N:0->16
N:0->16
N:0->16
D-PORT
D1-4
CFIN,OUT
ELC, ELP
BZB,BZ
CX
RR,RT,RH
KI1~4
1
11
1
10
10
10
10
30
30
30
30
40
40
40
40
50
50
50
50
60
60
60
60
20
20
20
20