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2N7002F Datasheet(PDF) 5 Page - NXP Semiconductors

Part # 2N7002F
Description  TrenchMOS Logic Level FET
PDF  11 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

2N7002F Datasheet(HTML) 5 Page - NXP Semiconductors

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Philips Semiconductors
2N7002F
TrenchMOS™ Logic Level FET
Product data
Rev. 01 — 11 February 2002
5 of 11
9397 750 09096
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
8.
Characteristics
Table 5:
Characteristics
Tj =25 °C unless otherwise specified
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
V(BR)DSS drain-source breakdown voltage
ID =10 µA; VGS =0V
Tj =25 °C
6075-
V
Tj = −55 °C
55
--V
VGS(th)
gate-source threshold voltage
ID = 1 mA; VDS =VGS; Figure 9
Tj =25 °C
12-
V
Tj = 150 °C
0.6
-
-
V
Tj = −55 °C
-
-
3.5
V
IDSS
drain-source leakage current
VDS =48V; VGS =0V
Tj =25 °C
-
0.01
1.0
µA
Tj = 150 °C
--10
µA
IGSS
gate-source leakage current
VGS = ±15 V; VDS = 0 V
-
10
100
nA
RDSon
drain-source on-state resistance
VGS = 10 V; ID = 500 mA; Figure 7 and 8
Tj =25 °C
-
1.7
2
Ω
Tj = 150 °C
-
-
3.7
Ω
VGS = 4.5 V; ID =75mA; Figure 7 and 8
Tj =25 °C
-
2.25
4
Ω
Dynamic characteristics
gfs
forward transconductance
VDS =10V; ID = 200 mA
100
300
-
mS
Ciss
input capacitance
VGS =0V; VDS = 10 V; f = 1 MHz; Figure 11
-
2540pF
Coss
output capacitance
-
18
30
pF
Crss
reverse transfer capacitance
-
7.5
10
pF
ton
turn-on time
VDD =50V; RD = 250 Ω; VGS =10V;
RG =50 Ω; RGS =50 Ω
-
3
10
ns
toff
turn-off time
-
1215ns
Source-drain diode
VSD
source-drain (diode forward) voltage IS = 300 mA; VGS =0V; Figure 12
-
0.85
1.5
V
trr
reverse recovery time
IS = 300 mA; dIS/dt = −100 A/µs; VGS =0V;
VDS =25V
-30
-
ns
Qr
recovered charge
-
30
-
nC



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