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2N7002F Datasheet(PDF) 2 Page - NXP Semiconductors

Part # 2N7002F
Description  TrenchMOS Logic Level FET
PDF  11 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

2N7002F Datasheet(HTML) 2 Page - NXP Semiconductors

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Philips Semiconductors
2N7002F
TrenchMOS™ Logic Level FET
Product data
Rev. 01 — 11 February 2002
2 of 11
9397 750 09096
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
5.
Quick reference data
6.
Limiting values
Table 2:
Quick reference data
Symbol Parameter
Conditions
Typ
Max
Unit
VDS
drain-source voltage (DC)
Tj =25to150 °C
-
60
V
ID
drain current (DC)
Tsp =25 °C; VGS = 10 V
-
475
mA
Ptot
total power dissipation
Tsp =25 °C
-
0.83
W
Tj
junction temperature
-
150
°C
RDSon
drain-source on-state resistance
VGS = 10 V; ID = 500 mA; Tj = 25
1.7
2
Ω
VGS = 4.5 V; ID = 75 mA; Tj = 25
2.25
4
Ω
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage (DC)
Tj =25to150 °C
-
60
V
VDGR
drain-gate voltage (DC)
Tj =25to150 °C; RGS =20kΩ
-60
V
VGS
gate-source voltage (DC)
-
±30
V
VGSM
peak gate-source voltage
tp ≤ 50 µs; pulsed; duty cycle = 25%
-
±40
V
ID
drain current (DC)
Tsp =25 °C; VGS =10V; Figure 2 and 3
-
475
mA
Tsp = 100 °C; VGS =10V; Figure 2
-
300
mA
IDM
peak drain current
Tsp =25 °C; pulsed; tp ≤ 10 µs; Figure 3
-
1.9
A
Ptot
total power dissipation
Tsp =25 °C; Figure 1
-
0.83
W
Tstg
storage temperature
−65
+150
°C
Tj
operating junction temperature
−65
+150
°C
Source-drain diode
IS
source (diode forward) current (DC)
Tsp =25 °C
-
475
mA
ISM
peak source (diode forward) current Tsp =25 °C; pulsed; tp ≤ 10 µs
-
1.9
A



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