© Koninklijke Philips Electronics N.V. 2002.

Printed in The Netherlands

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thereof does not convey nor imply any license under patent- or other industrial or

intellectual property rights.

Date of release: 11 February 2002

Document order number: 9397 750 09096

Contents

Philips Semiconductors

2N7002F

TrenchMOS™ Logic Level FET

1

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4

Pinning information . . . . . . . . . . . . . . . . . . . . . . 1

5

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

6

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

7

Thermal characteristics. . . . . . . . . . . . . . . . . . . 4

7.1

Transient thermal impedance . . . . . . . . . . . . . . 4

8

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5

9

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

10

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9

11

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 10

12

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10