prel

imin

ary

prel

imin

ary

WITH FAIL-SAFE 1 Vpp LINE DRIVER

Rev A2, Page 8/35

ABSOLUTE MAXIMUM RATINGS

These ratings do not imply operating conditions; functional operation is not guaranteed. Beyond these ratings device damage may occur.

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Max.

G001 V()

Voltage at VDD, PC, NC, PS, NS, PZ,

NZ, ACO

relative to GND

-6

6

V

G002 V()

Voltage at ERR

relative to GND

-6

8

V

G003 V()

Pin-To-Pin Voltage between VDD, GND,

PC, NC, PS, NS, PZ, NZ, ACO, ERR

6

V

G004 V()

Voltage at VDDS

no reversed polarity at VDD and GND

VDD

V

G005 V()

Voltage at GNDS relative to GND

no reversed polarity at VDD and GND

-0.3

+0.3

V

G006 V()

Voltage at X1...X6, SCL, SDA

-0.3

VDDS +

0.3

V

G007 I(VDD)

Current in VDD

-100

100

mA

G008 I()

Current in VDDS, GNDS

-50

50

mA

G009 I()

Current in X1...X6, SCL, SDA, ERR, PC,

NC, PS, NS, PZ, NZ

-20

20

mA

G010 I(ACO)

Current in ACO

-100

20

mA

G011 Vd()

ESD Susceptibility at all pins

HBM 100 pF discharged through 1.5 kΩ

2

kV

G012 Ptot

Permissible Power Dissipation

TSSOP20-TP, QFN32-5x5

400

mW

G013 Tj

Junction Temperature

-40

150

°C

G014 Ts

Storage Temperature Range

-40

150

°C

G015 V()

Voltage at VDDS

no reversed polarity at VDD and GND

VDD

V

THERMAL DATA

VDD = 4.3...5.5 V

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Typ.

Max.

T01 Ta

Operating Ambient Temperature Range iC-MSC TSSOP20-TP

-40

125

°C

iC-MSC QFN32-5x5

-40

125

°C

T02 Rthja

Thermal Resistance Chip to Ambient

TSSOP20-TP surface mounted to PCB (incl.

the thermal pad), according to JEDEC 51

35

K/W

T03 Rthja

Thermal Resistance Chip to Ambient

QFN32-5x5 surface mounted to PCB (incl. the

backside paddle), according to JEDEC 51

40

K/W

All voltages are referenced to Pin GNDS unless otherwise stated.

All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.