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Rev. A.8 - Oct., 2003
HPL5331
20
Copyright HIPAC Semiconductor, Inc.
www.hipacsemi.com
Application
Carrier Width
Cover Tape Width
Devices Per Reel
SOP- 8 / SOP-8-P
12
9.3
2500
TO- 252
16
13.3
2500
TO- 263
24
21.3
1000
Application
A
B
C
J
T1
T2
W
P
E
330
± 1
62 +1.5
12.75+
0.15
2
± 0.5
12.4
± 0.2
2
± 0.2
12
± 0. 3
8
± 0.1
1.75
±0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
SOP- 8
SOP-8-P
5.5
± 1
1.55 +0.1 1.55+ 0.25
4.0
± 0.1
2.0
± 0.1
6.4
± 0.1
5.2
± 0. 1
2.1
± 0.1 0.3±0.013
Application
A
B
C
J
T1
T2
W
P
E
330 ±3
100 ± 2
13 ± 0. 5
2 ± 0.5
16.4 + 0.3
-0.2
2.5± 0.5
16+ 0.3
- 0.1
8 ± 0.1
1.75± 0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
TO-252
7.5 ± 0.1
1.5 +0.1
1.5± 0.25
4.0 ± 0.1
2.0 ± 0.1
6.8 ± 0.1
10.4± 0.1
2.5± 0.1
0.3±0.05
Application
A
B
C
J
T1
T2
W
P
E
380±380 ± 2
13 ± 0. 5
2 ± 0.5
24 ± 42± 0.3
24 + 0.3
- 0.1
16 ± 0.1
1.75± 0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
TO-263
11.5 ± 0.1
1.5 +0.1
1.5± 0.25
4.0 ± 0.1
2.0 ± 0.1
10.8 ± 0.1
16.1± 0.1
5.2± 0.1
0.35±0.013
Cover Tape Dimensions
(mm)
Carrier Tape
CONTACT
HIPAC Semiconductor, Inc.
2540 North First Street, Suite 308
San Jose, CA 95131-1016
U.S.A.
Tel: 1-408-943-0808
Fax: 1-408-943-0878
E-Mail: info@hipacsemi.com
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