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ABSOLUTE MAXIMUM RATINGS

THERMAL CHARACTERISTICS

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ADS5444

SLWS162A – AUGUST 2005 – REVISED FEBRUARY 2006

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Product

Package-

Package

Specified

Package

Ordering

Transport

Lead

Temperature

Marking

Number

Media,

Range

Quantity

ADS5444IPFP

Tray, 96

ADS5444

PFP

–40°C to 85°C

ADS5444IPFP

PowerPAD

ADS5444IPFPR

Tape and Reel, 1000

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For the most current product and ordering information, see the Package Option Addendum located at the end of this document, or see

the TI website at www.ti.com.

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Thermal pad size: 7,5 mm x 7,5 mm (typ)

VALUE / UNIT

6 V

Supply voltage

5 V

Analog input to GND

Clock input to GND

CLK to CLK

±2.5 V

Digital data output to GND

Operating temperature range

–40°C to 85°C

Maximum junction temperature

150°C

Storage temperature range

–65°C to 150°C

ESD Human Body Model (HBM)

2.5 kV

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Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond

those specified is not implied.

PARAMETER

TEST CONDITIONS

TYP

UNIT

Soldered slug, no airflow

21.7

°C/W

Soldered slug, 250-LFPM airflow

15.4

°C/W

θ

JA

Unsoldered slug, no airflow

50

°C/W

Unsoldered slug, 250-LFPM airflow

43.4

°C/W

θ

JC

Bottom of package (heatslug)

2.99

°C/W

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Using 36 thermal vias (6 x 6 array). See the Application Section.

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