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MSM64162 Datasheet(PDF) 6 Page - OKI electronic componets |
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MSM64162 Datasheet(HTML) 6 Page - OKI electronic componets |
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6 / 39 page ![]() 6/39 ¡ Semiconductor MSM64162 PAD CONFIGURATION Pad Layout Chip Size : 4.69 mm ¥ 4.41 mm Chip Thickness : 350 mm (typ.) Coordinate Origin : Chip center Pad Hole Size : 110 mm ¥ 110 mm Pad Size : 130 mm ¥ 130 mm Minimum Pad Pitch : 180 mm Note: The chip substrate voltage is VDD. 51 52 53 54 55 56 57 58 59 60 61 62 63 64 1 2 3 4 5 6 7 8 9 10 1112 13 1415 1617 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 46 47 48 49 50 y x 45 44 43 42 |
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