¡ Semiconductor

MSM7705-01/02/03

19/20

NOTES ON USED

• To ensure proper electrical characteristics, use bypass capacitors with excellent high frequency

characteristics for the power supply and keep them as close as possible to the device pins.

• Connect the AG pin and the DG pin as close as possible. Connect to the system ground with

low impedance.

• Mount the device directly on the board when mounted on PCBs. Do not use IC sockets. If the

use of IC socket is unavoidable, use the short lead type socket.

• When mounted on a frame, use electro-magnetic shielding, if any electro-magnetic wave

sources such as power supply transformers surround the device.

up that may otherwise occur when power is turned on.

• Use a low noise (particularly, low level type of high frequency spike noise or pulse noise)

power supply to avoid erroneous operation and the degradation of the characteristics of these

devices.