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TH08 Datasheet

1. Electrical Specifications

Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.

Table 1. Recommended Operating Conditions

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Power Supply

VDD

1.9

3.6

Operating Temperature

–40

—

+125

°C

Table 2. General Specifications

1.9 < VDD < 3.6 V; TA = –40 to 125 °C default conversion time unless otherwise noted.

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Input Voltage High

VIH

SCL, SDA pins

0.7xVDD

—

Input Voltage Low

VIL

SCL, SDA pins

—

0.3xVDD

Input Voltage Range

VIN

SCL, SDA pins with respect to GND

0.0

—

VDD

Input Leakage

IIL

SCL, SDA pins

—

μA

Output Voltage Low

VOL

SDA pin; IOL = 2.5 mA; VDD = 3.3 V

—

0.6

SDA pin; IOL = 1.2 mA;

VDD = 1.9 V

—

0.4

Current

Consumption

IDD

RH conversion in progress

—

150

180

μA

Temperature conversion in progress

—

120

μA

Standby, –40 to +85 °C2

—

0.06

0.62

μA

Standby, –40 to +125 °C2

—

0.06

3.8

μA

Peak IDD during powerup3

—

3.5

4.0

Peak IDD during I2C operations4

—

3.5

4.0

After writing to user registers5

—

μA

Heater Current6

IHEAT

—

3.1

—

Notes:

1. Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will

be tCONV(RH) + tCONV(T).

2. No conversion or I2C transaction in progress. Typical values measured at 25 °C.

3. Occurs once during powerup. Duration is <5 msec.

4. Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration is

<100 µs when I2C clock speed is >100 kHz (>200 kHz for 2-byte commands).

5. IDD after a user register write. Initiating any other subsequent I2C transaction on the same bus (such as the user

register read, starting an RH measurement, or traffic directed at other I2C devices) will transition the device to standby

mode.

6. Additional current consumption when HTRE bit enabled. See section “5.5. Heater” for more information

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