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GPBA01B Datasheet(PDF) 24 Page - Generalplus Technology Inc. |
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GPBA01B Datasheet(HTML) 24 Page - Generalplus Technology Inc. |
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24 / 29 page ![]() GPBA01B © Generalplus Technology Inc. Proprietary & Confidential 24 MAY 28, 2007 Version: 1.1 12. PACKAGE/PAD LOCATIONS 12.1. PAD Assignment and Locations VDD 34 35 36 37 38 39 40 41 42 43 44 1 2 3 4 5 6 7 8 9 10 11 12 23 22 21 20 19 18 17 16 15 14 13 33 32 31 30 29 28 27 26 25 24 P22 P21 CI CO CLKO DVP XO P00 P17 P16 P15 P14 P13 P12 P11 P10 Sunplus P20 P55(WE) OSCO(OE) 1 X Y (0,0) This IC substrate should be connected to VSS Note1: To ensure that the IC functions properly, please bond all of VDD and VSS pins. Note2: The 0.1 μF capacitor between VDD and VSS should be placed to IC as close as possible. 12.2. Ordering Information Product Number Package Type GPBA01B - C Chip form |
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