eGaN® FET DATASHEET

EPC2019

EPC – THE LEADER IN GaN TECHNOLOGY | WWW.EPC-CO.COM | COPYRIGHT 2019 |

| 5

2019

YYYY

ZZZZ

Die orientation dot

Gate Pad bump is

under this corner

Part

Number

Laser Markings

Part #

Marking Line 1

Lot_Date Code

Marking line 2

Lot_Date Code

Marking Line 3

EPC2019

2019

YYYY

ZZZZ

DIE MARKINGS

TAPE AND REEL CONFIGURATION

4 mm pitch, 8 mm wide tape on 7” reel

7” reel

a

d

e

f

g

c

b

EPC2019 (note 1)

Dimension (mm) target min max

a

8.00 7.90 8.30

b

1.75 1.65 1.85

c (see note)

3.50 3.45 3.55

d

4.00 3.90 4.10

e

4.00 3.90 4.10

f (see note)

2.00 1.95 2.05

g

1.5

1.5

1.6

Note 1: MSL 1 (moisture sensitivity level 1) classied according to IPC/JEDEC industry standard.

Note 2: Pocket position is relative to the sprocket hole measured as true position of the pocket,

not the pocket hole.

Die

orientation

dot

Gate

solder bar is

under this

corner

Die is placed into pocket

solder bar side down

(face side down)

Loaded Tape Feed Direction

Figure 12: Safe Operating Area

0.1

1

10

100

0.1

1

10

100

1000

Pulse Width

100 ms

10 ms

1 ms

100 µs

10 µs