eGaN® FET DATASHEET

EPC2019

EPC – THE LEADER IN GaN TECHNOLOGY | WWW.EPC-CO.COM | COPYRIGHT 2019 |

| 6

DIE OUTLINE

Solder Bar View

Side View

1

2

6

7

4

3

5

A

e

g

g

X2

X4

f

X3

Seating plane

DIM

MIN

Nominal

MAX

A

2736

2766

2796

B

920

950

980

c

697

700

703

d

247

250

253

e

168

183

198

f

245

250

255

g

600

600

600

h

450

450

450

i

235

250

265

MICROMETERS

Pad no.1 is Gate;

Pad no. 3, 5 are Drain;

Pad no. 2, 4, 6 are Source;

*Substrate pin should be connected to Source

Pad no. 1 is Gate

Pad no. 3, 5 are Drain

Pad no. 2, 4, 6 are Source

Pad no. 7 is Substrate*

*Substrate pin should be connected to Source

2

1

7

6

4

3

5

230

X3

230

X4

2766

600

X2

600

X4

The land pattern is solder mask defined.

Copper is larger than the solder mask opening.

Solder mask is 10 µm smaller per side than bump.

RECOMMENDED

LAND PATTERN

(measurements in µm)

Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any products herein to

improve reliability, function or design. EPC does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights, nor the rights of others.

eGaN® is a registered trademark of Efficient Power Conversion Corporation.

EPC Patent Listing: epc-co.com/epc/AboutEPC/Patents.aspx

RECOMMENDED

STENCIL DRAWING

(units in µm)

Recommended stencil should be 4 mil (100 μm)

thick, must be laser cut , opening per drawing.

The corner has a radius of R60.

Intended for use with SAC305 Type 3 solder,

reference 88.5% metals content

Additional assembly resources available at

https://epc-co.com/epc/DesignSupport/

AssemblyBasics.aspx

230

X3

230

X4

2766

600

X2

600

X4

2

1

7

6

4

3

5

Information subject to

change without notice.

Revised August, 2019