SAM5808B datasheet(17/83 Pages) ETC1

17 / 83 page

SAM5808B

SAM5808B.pdf

– Rev 14/05/2018

4.3.

Pin description

White cells describes Primary function of the pin

Grey cells describes Secondary function of the pin

Pink cells describes GPIO function of the pin

Yellow cells describes special function of the pin at start-up

indicates pin with built-in pull-down resistor. (PD) indicates that the pull-down can be disabled.

indicates pin with built-in pull-up resistor. (PU) indicates that the pull-down can be disabled.

5VT

indicates a 5 volt tolerant Input or I/O pin.

MEM

indicates a pad supplied by VM.

DR4, DR8, DR12

indicates driving capability at VOL, VOH (see § 7.3.- D.C. Characteristics)

SR3:

If GPIO is used as input, an external 330

Ω (min) serial resistor is needed for safe ROM boot.

SR7:

If GPIO is used as input, an external 750

Ω (min) serial resistor is needed for safe ROM boot.

4.3.1. Power Supply Group

Pin name

Pin#

Type

Mem

Cfg

Description

VD12

34,68,

111,147,

148

PWR

1-4

Power for the internal core, +1.2V nominal (1.2V

 10 %).

These pins must be connected to the output of the regulator

OUTVC12 (pin 174).

100nF+10nF capacitors should be connected between each

of these pins and a close ground plane.

10µF should be added on two opposite sides.

VC12

173

PWR

1-4

Power for the internal PLL, +1.2V nominal (1.2V

 10 %).

This pin must be connected to the output of the regulator

OUTVC12 (pin 174).

10µF+100nF capacitors should be connected between this

pin and a close ground plane.

VD33

9,14,89,

103,115,

141,149,

162

PWR

1-4

+3.3V power for periphery. All these pins should be returned

to nominal 3.3V.

100nF decoupling capacitors should be connected between

half of these pins and ground plane

GND

46,132,

172

PWR

1-4

Digital ground. All these pins should be returned to a ground

plane

VD33O

168

PWR

1-4

+3.3V power for internal oscillator OSC2.

A 100nF filtering capacitor should be connected between

VD33O and GNDO.

GNDO

171

PWR

1-4

Digital ground for internal oscillator OSC2. This pin should

be returned to the ground plane

VD33R

175

PWR

1-4

+3.3V power for internal 3.3V to 1.2 V regulator.

A 10µF filtering capacitor should be connected between

VD33R and GNDR.

GNDR

176

PWR

1-4

Digital ground for internal 3.3V to 1.2 V regulator. This pin

should be returned to the ground plane

VD33U0,

VD33U1

122,127

PWR

1-4

+3.3V power for internal USB ports. 10µF+100nF+10nF

capacitors should be connected between VD33U0 and

GNDU0, VD33U1 and GNDU1.

GNDU0,

GNDU1

125,130

PWR

1-4

Digital ground for internal USB ports. These pins should be

returned to a ground plane

21,28,33,

40,47,54,

61,75

PWR

1-4

Memory PAD Power +2.25V to +3.6V. Depending on the

memory type, all VM pins should be returned to 3.3V or

2.5V.

100nF capacitors should be connected between half of

these pins and a close ground plane.

10nF capacitors should be connected between the other half

of these pins and a close ground plane.

10µF should be added on both sides.

SAM5808B Datasheet(PDF) 17 Page - List of Unclassifed Manufacturers

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