 2017 Microchip Technology Inc.

DS20005808A-page 21

DSC63XX

4-Lead CDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

TITLE

4 LEAD CDFN 3.2x2.5mm COL PACKAGE OUTLINE & RECOMMENDED LAND PATTERN

DRAWING # CDFN3225-4LD-PL-1

UNIT MM

NOTE:

1.

Green shaded rectangles in Recommended Land Pattern are solder stencil opening.