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RT1050 Datasheet(PDF) 6 Page - NXP Semiconductors |
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RT1050 Datasheet(HTML) 6 Page - NXP Semiconductors |
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6 / 110 page  i.MX RT1050 Crossover Processors Data Sheet for Industrial Products, Rev. 1.4, 01/2020 6 NXP Semiconductors i.MX RT1050 introduction Figure 1 describes the part number nomenclature so that characteristics of a specific part number can be identified (for example, cores, frequency, temperature grade, fuse options, and silicon revision). The primary characteristic which describes which data sheet applies to a specific part is the temperature grade (junction) field. • The i.MX RT1050 Crossover Processors for Industrial Products Data Sheet (IMXRT1050IEC) covers parts listed with a “C (Industrial temp)” MIMXRT1051CVJ5B • 528 MHz, industrial grade for general purpose with MPU/FPU •eDMA • Boot ROM (96 KB) • On-chip RAM (512 KB) •SEMC •GPT x2 • 4-channel PIT •PWM x4 • ENC x4 • WDOG x4 • No LCD/CSI/PXP • SPDIF x1 •SAI x3 • MQS x1 • USB OTG x2 • eMMC 4.5/SD 3.0 x2 • SPI x4 • Ethernet •UART x8 •I2C x4 • FlexSPI •CAN x2 • FlexIO x2 • 127 GPIOs • HAB/DCP/BEE • TRNG •SNVS •SJC • ADC x2 •ACMP x4 •TSC • DCDC • Temperature sensor • GPC hardware power management controller 12 x 12 mm, 0.8 mm pitch, 196-pin MAPBGA -40 to +105 C MIMXRT1052CVJ5B • 528 MHz, industrial grade for general purpose with MPU/FPU •eDMA • Boot ROM (96 KB) • On-chip RAM (512 KB) •SEMC •GPT x2 • 4-channel PIT •PWM x4 • ENC x4 • WDOG x4 • LCD/CSI/PXP • SPDIF x1 •SAI x3 • MQS x1 • USB OTG x2 • eMMC 4.5/SD 3.0 x2 • SPI x4 • Ethernet •UART x8 •I2C x4 • FlexSPI •CAN x2 • FlexIO x2 • 127 GPIOs • HAB/DCP/BEE • TRNG •SNVS •SJC • ADC x2 •ACMP x4 •TSC • DCDC • Temperature sensor • GPC hardware power management controller 12 x 12 mm, 0.8 mm pitch, 196-pin MAPBGA -40 to +105 C Table 1. Ordering information Part Number Features Package Junction Temperature Tj ( C) |
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