TLP290(SE

8

2019-05-20

© 2019

Toshiba Electronic Devices & Storage Corporation

Soldering and Storage

1. Soldering

1.1 Soldering

When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as

much as possible by observing the following conditions.

1) Using solder reflow

∙Temperature profile example of lead (Pb) solder

∙Temperature profile example of using lead (Pb)-free solder

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)

･Please preheat it at 150°C between 60 and 120 seconds.

･Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.

3) Using a soldering iron

Complete soldering within 10 seconds below

260°C, or within 3 seconds at 350°C. Each pin may

be heated at most once.

Time

(s)

(°C)

240

210

160

60 to 120s

less than 30s

140

Time

(s)

(°C)

260

230

190

60 to 120s

30 to 50s

180

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste

type used by the customer within the

described profile.

This

profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste

type used by the customer within the

described profile.