NXP Semiconductors

FS6500, FS4500

Safety Power System Basis Chip with CAN FD and LIN Transceivers

FS6500-FS4500SDS

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Short data sheet: advance information

Rev. 1.0 — 14 December 2017

11 / 20

Symbol

Ratings

Value

Unit

Notes

ESD voltage

Human body model (JESD22/A114) – 100 pF, 1.5 kΩ

• All pins

• VSUP1,2,3, VSENSE, VAUX, IO_0,4, FS0B, FS1B, DEBUG

• CANH, CANL

• LIN

±2.0

±4.0

±6.0

±8.0

kV

kV

kV

kV

Charge device model (JESD22/C101):

• All pins

• Corner pins

±500

±750

V

V

System level ESD (gun test)

• VSUP1, 2, 3, VSENSE, VAUX, IO_0, 4, 5, FS0B, FS1B

330 Ω/150 pF unpowered according to IEC61000-4-2

±8.0

kV

330 Ω/150 pF unpowered according to OEM LIN, CAN, FLexray

Conformance

±8.0

kV

2.0 kΩ/150 pF unpowered according to ISO10605.2008

±8.0

kV

2.0 kΩ/330 pF powered according to ISO10605.2008

• CANH, CANL

±8.0

kV

330 Ω/150 pF unpowered according to IEC61000-4-2

±15.0

kV

330 Ω/150 pF unpowered according to OEM LIN, CAN, FLexray

conformance

±12.0

kV

2.0 kΩ/150 pF unpowered according to ISO10605.2008

±15.0

kV

2.0 kΩ/330 pF powered according to ISO10605.2008

• LIN

±12.0

kV

330 Ω/150 pF unpowered according to IEC61000-4-2:

±12.0

kV

330 Ω/150 pF unpowered according to OEM LIN, CAN, flexray conformance ±12.0

kV

2.0 kΩ/150 pF unpowered according to ISO10605.2008

±12.0

kV

2.0 kΩ/330 pF powered according to ISO10605.2008

±12.0

kV

[2]

Thermal ratings

Ambient temperature

–40 to 125

°C

Junction temperature

–40 to 150

°C

Storage temperature

–55 to 150

°C

Thermal resistance

Thermal resistance junction to ambient

30

°C/W

[3]

Thermal resistance junction to case top

23.8

°C/W

[4]

Thermal resistance junction to case bottom

0.9

°C/W

[5]

[1]

[2]

Compared to AGND

[3]

Per JEDEC JESD51-6 with the board (JESD51-7) horizontal

[4]

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC - 883 Method 1012.1).

[5]

Thermal resistance between the die and the solder pad on the bottom of the packaged based on simulation without any interface resistance.