MIC23156

DS20005919A-page 6

 2017 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Symbol

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Storage Temperature

–65

—

+150

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 10 sec.

Junction Temperature Range

–40

—

+125

°C

—

Package Thermal Resistances

Thermal Resistance WLCSP 16-Ball

—

150

—

°C/W

—

Thermal Resistance QFN-17

—89

—

°C/W

—

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

imum allowable power dissipation will cause the device operating junction temperature to exceed the max-

imum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.