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AF3028 Datasheet(PDF) 1 Page - 3M Electronics |
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AF3028 Datasheet(HTML) 1 Page - 3M Electronics |
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1 / 6 page ![]() 3 Scotch-WeldTM Structural Core SpliceAdhesives AF 3028 • AF 3028 FR Introduction 3M™ Scotch-Weld™ Structural Core Splice Adhesives AF 3028 and AF 3028 FR are 250°F to 350°F (121°C to 176°C) curing, low density, expandable core splice adhesive films. AF 3028 and AF 3028 FR were designed for filling mismatch areas or reinforcing and splicing honeycomb core. Advantages • Expands during cure for void filling and core splicing • Low sag during cure • Low volatile loss during cure • High performance from -67°F to 350°F (-55°C to 176°C) • AF 3028 FR has flame retardant properties • Can be cured/expanded at slow heat up rates Technical Data Issue No. 2 Description AF 3028 AF 3028 FR Color: Off White Off White Base: Epoxy Epoxy Form: Unsupported Film Unsupported Film Thickness: 50 ± 5 mil 50 ± 5 mil Weight (approx.): 0.26 lb/ft2 0.27 lb/ft2 Expansion Ratio (approx.): 1.9 2.1 Volatile Loss (250°F [121°C] cure): Less than 1% Less than 1% Uncured Density (approx.): 63 lb/ft3 64 lb/ft3 Available as 10" x 24" flat sheets or as rolls in various length and widths. |
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