LTC4444 datasheet(4/18 Pages) AD

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LTC7060

Rev. A

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ELECTRICAL CHARACTERISTICS The

denotes the specifications which apply over the specified operating

temperature range, otherwise specifications are at TA = 25°C (Note 2). VCC = VBGVCC = VBST =10V, VBGRTN = VSW = 0V, unless

otherwise noted.

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Low Side Gate Driver Output (BG)

VOH(BG)

BG High Output Voltage

IBG = –100mA, VOH(BG) = VBGVCC – VBG

150

VOL(BG)

BG Low Output Voltage

IBG = 100mA, VOL(BG)=VBG – VBGRTN

RUP(BG)

BG Pull-Up Resistance

VBGVCC-BGRTN =10V

1.5

RDOWN(BG)

BG Pull-Down Resistance

VBGVCC-BGRTN =10V

0.8

High Side Gate Driver Output (TG)

VOH(TG)

TG High Output Voltage

ITG = –100mA, VOH(TG) = VBST – VTG

150

VOL(TG)

TG Low Output Voltage

ITG = 100mA, VOL(TG) = VTG – VSW

RUP(TG)

TG Pull-Up Resistance

VBST-SW = 10V

1.5

RDOWN(TG)

TG Pull-Down Resistance

VBST-SW = 10V

0.8

Switching Time

tPHL(BG)

PWM High to BG Low Propagation Delay

tPHL(TG)

PWM Low to TG Low Propagation Delay

tr(BG)

BG Output Rise Time

CLOAD = 3.3nF (Note 5)

tf(BG)

BG Output Fall Time

CLOAD = 3.3nF (Note 5)

tr(TG)

TG Output Rise Time

CLOAD = 3.3nF (Note 5)

tf(TG)

TG Output Fall Time

CLOAD = 3.3nF (Note 5)

tPH(EN)

EN High to TG/BG High Propagation Delay

tPL(EN)

EN Low to TG/BG Low Propagation Delay

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Ratings for extended periods may affect device reliability and

lifetime.

Note 2: The LTC7060E is guaranteed to meet performance specifications

from 0°C to 85°C junction temperature. Specifications over the −40°C

to 125°C operating junction temperature range are assured by design,

characterization and correlation with statistical process controls. The

LTC7060I is guaranteed over the −40°C to 125°C operation junction

temperature range. The LTC7060J is guaranteed over the −40°C to 150°C

operation junction temperature range. The LTC7060H is guaranteed over

the −40°C to 150°C operation junction temperature range. High junction

temperature degrades operation lifetimes; operating lifetime is derated

for junction temperatures greater than 125°C. Note that the maximum

ambient temperature consistent with these specifications is determined by

specific operating conditions in conjunction with board layout, the rated

package thermal impedance and other environment factors.

Note 3: TJ is calculated from the ambient temperature TA and power

dissipation PD according to the following formula

TJ = TA + (PD • 51°C/W) for LFCSP package; TJ = TA + (PD • 40°C/W) for

MSOP package.

Note 4: The total current includes both the current from BGVCC/BST to

BGRTN/SW and the current to SGND. Dynamic supply current is higher

due to the gate charge being delivered at the switching frequency.

Note 5: Rise and fall times are measured using 10% and 90% levels.

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