DRV102 datasheet(12/23 Pages) TI

12 / 23 page

DRV102

SBVS009A

www.ti.com

FIGURE 11. TO-220 Thermal Resistance versus Aluminum Plate Area.

For best thermal performance, the tab of the DDPAK sur-

face-mount version should be soldered directly to a circuit

board copper area. Increasing the copper area improves heat

dissipation. Figure 12 shows typical thermal resistance from

junction-to-ambient as a function of the copper area.

POWER DISSIPATION

Power dissipation depends on power supply, signal, and load

conditions. Power dissipation is equal to the product of

FIGURE 10. TO-220 and DDPAK Solder Footprints.

PACKAGE MOUNTING

Figure 10 provides recommended PCB layouts for both the

TO-220 and DDPAK power packages. The tab of both

packages is electrically connected to ground (pin 4). It may

be desirable to isolate the tab of TO-220 package from its

mounting surface with a mica (or other film) insulator (see

Figure 11). For lowest overall thermal resistance, it is best to

isolate the entire heat sink/DRV102 structure from the

mounting surface rather than to use an insulator between the

semiconductor and heat sink.

7-Lead DDPAK(1)

(Package Drawing #328)

7-Lead TO-220

(Package Drawing #327)

NOTE: (1) For improved thermal performance increase footprint area.

See Figure 12, “Thermal Resistance versus Circuit Board Copper Area”.

0.05

0.51

0.105

0.05

0.035

0.04

Mean dimensions in inches. Refer to end of data sheet

or Appendix C of Burr-Brown Data Book for tolerances

and detailed package drawings. For further information

on solder pads for surface-mount devices consult

Application Bulletin AB-132.

234567

Aluminum Plate Area (inches2)

THERMAL RESISTANCE

vs ALUMINUM PLATE AREA

Aluminum Plate Area

Flat, Rectangular

Aluminum Plate

DRV102

TO-220 Package

0.030

0.062

0.050

Vertically Mounted

in Free Air

Optional mica or film insulator

for electrical isolation. Adds

approximately 1

°C/W.

Aluminum Plate

Thickness (inches)

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