DLP160AP datasheet(2/41 Pages) TI

2 / 41 page

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 6

6.1 Absolute Maximum Ratings........................................ 6

6.2 Storage Conditions..................................................... 6

6.3 ESD Ratings............................................................... 7

6.4 Recommended Operating Conditions.........................7

6.5 Thermal Information..................................................10

6.6 Electrical Characteristics...........................................10

6.7 Timing Requirements................................................ 11

6.8 Switching Characteristics(1) ..................................... 16

6.9 System Mounting Interface Loads............................ 17

6.10 Micromirror Array Physical Characteristics............. 18

6.11 Micromirror Array Optical Characteristics............... 19

6.12 Window Characteristics.......................................... 20

6.13 Chipset Component Usage Specification............... 20

7 Detailed Description......................................................21

7.1 Overview................................................................... 21

7.2 Functional Block Diagram......................................... 21

7.3 Feature Description...................................................22

7.4 Device Functional Modes..........................................22

7.5 Optical Interface and System Image Quality

Considerations............................................................ 22

7.6 Micromirror Array Temperature Calculation.............. 23

7.7 Micromirror Landed-On/Landed-Off Duty Cycle....... 24

8 Application and Implementation.................................. 28

8.1 Application Information............................................. 28

8.2 Typical Application.................................................... 29

9 Power Supply Recommendations................................31

9.1 Power Supply Power-Up Procedure......................... 31

9.2 Power Supply Power-Down Procedure.....................31

9.3 Power Supply Sequencing Requirements................ 32

10 Layout...........................................................................34

10.1 Layout Guidelines................................................... 34

10.2 Layout Example...................................................... 34

11 Device and Documentation Support..........................35

11.1 Device Support........................................................35

11.2 Receiving Notification of Documentation Updates.. 35

11.3 Support Resources................................................. 35

11.4 Trademarks............................................................. 35

11.5 Electrostatic Discharge Caution.............................. 35

11.6 Glossary.................................................................. 36

12 Mechanical, Packaging, and Orderable

Information.................................................................... 36

4 Revision History

DATE

REVISION

NOTES

October 2021

Initial release.

DLP160AP

DLPS226 – OCTOBER 2021

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