FEDW9045BC-03

OKI Semiconductor

MBF9045BC

9/11

RECOMMENDATION FOR SOLDER PAD PATTERN

The solder pad pattern should be designed by customers because it depends on the electrical

performance of the customers’ system. Following is an example of solder pad pattern which is used in

OKI’s package evaluation board. Please be noted that this is for reference purpose only.

0.1 mm

0.1 mm

0.5 mm

PCB pad pattern

Metal mask pattern

0.1 mm

25

µm

25

µm

Pad of Device

Please pay attention to the following items to maintain electrical performance.

(1)

Metal mask pattern for cream solder should be 25

µm smaller on each side. Metal mask is 0.15 mm in

thickness.

(2)

As the impedance of Tx, Rx, ANT is designed for 50

Ω, please consider this for the design of mother board.