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2021 Microchip Technology Inc. and its subsidiaries

DS20006631A-page 5

MIC5018

FIGURE 1-1:

Test Circuit.

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Ambient Temperature Range

–40

—

+85

°C

—

Lead Temperature

—

—

—

+300

°C

Soldering, 10 seconds

Package Thermal Resistance

Thermal Resistance, SOT-143

—

+220

—

°C/W —

—

+130

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum rating. Sustained junction temperatures above that maximum can impact device reliability.