LTC4213

19

Rev. A

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PACKAGE DESCRIPTION

2.00 ±0.10

NOTE:

1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

0.40 ±0.10

BOTTOM VIEW—EXPOSED PAD

0.56 ±0.05

0.75 ±0.05

R = 0.115

TYP

R = 0.05

TYP

2.15 ±0.05

3.00 ±0.10

1

4

8

5

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0 – 0.05

(DDB8) DFN 1116 REV C

0.25 ±0.05

0.50 BSC

PIN 1

R = 0.20 OR

0.25

× 45°

CHAMFER

0.25 ±0.05

2.20 ±0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.61 ±0.05

1.15 ±0.05

0.70 ±0.05

2.55 ±0.05

PACKAGE

OUTLINE

0.50 BSC

DDB Package

8-Lead Plastic DFN (3mm

× 2mm)

(Reference LTC DWG # 05-08-1702 Rev C)