AM2732 datasheet(49/97 Pages) TI

49 / 97 page

Table 7-9. Device Wake-Up Sequence Timing (continued)

NAME

DESCRIPTION

MIN

TYP

MAX

UNIT

tSU_SOP

Setup time for SOP signals to be sampled by the rising edge of

NRESET.

Device is ready to sample SOP pin states anytime after power supplies

are at recommended operating conditions.

tMSS_BOOT_START

Typical delay after NRESET rising edge before boot ROM to begins

MSS code execution.

Value depends on whether device is operating directly from a crystal

source or oscillator (REFCLK) source. Faster startup possible with the

oscillator mode.

0.5

7.0

tRESET_POWER_DELAY

During power off events, delay after NRESET is brought from VIOIN to

VSS level to when power pins can be powered off.

Device power pins can be powered off anytime after NRESET is

brought to VSS level.

7.11.2 Clock Specifications

An external crystal is connected to the device pins. Figure 7-2 shows the crystal implementation.

40 MHz

CLKP

CLKM

Cf1

Cf2

Figure 7-2. Crystal Implementation

Note

The load capacitors, Cf1 and Cf2 in Figure 7-2, should be chosen such that Equation 1 is satisfied.

CL in the equation is the load specified by the crystal manufacturer. All discrete components used

to implement the oscillator circuit should be placed as close as possible to the associated oscillator

CLKP and CLKM pins. Note that Cf1 and Cf2 include the parasitic capacitances due to PCB routing.

f 2

(1)

Table 7-10 lists the electrical characteristics of the clock crystal.

Table 7-10. Crystal Electrical Characteristics (Oscillator Mode)

NAME

DESCRIPTION

MIN

TYP

MAX

UNIT

Parallel resonance crystal frequency

MHz

Crystal load capacitance

ESR

Crystal ESR

Temperature range

Expected temperature range of operation

–40

150

°C

Frequency tolerance

Crystal frequency tolerance(1) (2) (3)

–200

200

ppm

Drive level

200

µW

(1)

The crystal manufacturer's specification must satisfy this requirement.

(2)

Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance.

(3)

Crystal tolerance affects sensor accuracy if AM273x used as clock source for attached sensors.

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AM2732, AM2732-Q1

SWRS245A – DECEMBER 2021 – REVISED FEBRUARY 2022

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