LPC2387 datasheet(62/66 Pages) NXP

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LPC2387

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Product data sheet

Rev. 5.1 — 16 October 2013

62 of 66

NXP Semiconductors

LPC2387

Single-chip 16-bit/32-bit MCU

LPC2387 v.4

20110210

Product data sheet

LPC2387 v.3

Modifications:

• Table 3 “Pin description”: Added Table note 9 for XTAL1 and XTAL2 pins.

• Table 3 “Pin description”: Added Table note 10 for RTCX1 and RTCX2 pins.

• Table 4 “Limiting values”: Changed VESD min/max to 2500/+2500.

• Table 7 “Static characteristics”: Removed Rpu.

• Table 7 “Static characteristics”, Table note 13: Changed value from 18 to 33.

• Table 7 “Static characteristics”: Updated min, typical and max values for oscillator pins.

• Table 7 “Static characteristics”: Updated conditions and typical values for IDD(DCDC)pd(3V3),

IBATact; added IDD(DCDC)dpd(3V3) and IBAT.

• Table 7 “Static characteristics”: Changed I2C-bus Vhys typical from 0.5VDD to 0.05VDD.

• Section 2 “Features and benefits”: Added deep power-down information.

• Section 7.2 “On-chip flash programming memory” “On-chip flash programming memory”:

Removed text regarding flash endurance minimum specs.

• Section 7.23 “RTC and battery RAM”: Added deep power-down information.

• Section 7.24.2 “PLL”: Changed input clock frequency max to 25 MHz.

• Section 7.24.3 “Wake-up timer”: Added deep power-down information.

• Section 7.24.4 “Power control”: Added deep power-down information.

• Added Section 7.24.4.4 “Deep power-down mode”.

• Section 7.25.2 “Brownout detection”: Changed VDD(3V3) to VDD(DCDC)(3V3).

• Added Section 9 “Thermal characteristics”.

• Added Section 10.1 “Power-down mode”.

• Added Section 10.2 “Deep power-down mode”.

• Added Section 10.3 “Electrical pin characteristics”.

• Added Section 11.1 “Internal oscillators”.

• Added Section 11.2 “I/O pins”.

• Added Section 11.4 “Flash memory”.

• Added Section 13 “DAC electrical characteristics”.

• Added Section 14.2 “Crystal oscillator XTAL input and component selection”.

• Added Section 14.3 “RTC 32 kHz oscillator component selection”.

• Added Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”.

• Added Section 14.5 “Standard I/O pin configuration”.

• Added Section 14.6 “Reset pin configuration”.

• Moved Figure 12 “External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)” to

below Table 8 “Dynamic characteristics”.

LPC2387 v.3

20081029

Product data sheet

LPC2387 v.2

Modifications:

• Added USB host/OTG features

• Table 4: changed storage temperature range from 40 C/125 C to 65 C/150 C.

• Table 6, Vhys, moved 0.4 from Typ to Min column.

• Table 6, VI, added Table note 8.

• Table 6: updated Table note 10.

LPC2387 v.2

20080201

Product data sheet

LPC2387 v.1

20080114

Product data sheet

Table 19.

Revision history …continued

Document ID

Release date

Data sheet status

Change notice

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