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LPC2387 Datasheet(PDF) 13 Page - NXP Semiconductors

Part # LPC2387
Description  Single-chip 16-bit/32-bit MCU; 512 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC
PDF  66 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC2387 Datasheet(HTML) 13 Page - NXP Semiconductors

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LPC2387
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5.1 — 16 October 2013
13 of 66
NXP Semiconductors
LPC2387
Single-chip 16-bit/32-bit MCU
[1]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
[2]
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a DAC input,
digital section of the pad is disabled.
[3]
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
[4]
Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. This pad requires an external pull-up to provide
output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines.
Open-drain configuration applies to all functions on this pin.
[5]
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
[6]
5 V tolerant pad with 10 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
[7]
This pin has no built-in pull-up and no built-in pull-down resistor.
[8]
This pin has a built-in pull-up resistor.
[9]
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[10] Pad provides special analog functionality.
[11] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
[12] If the RTC is not used, these pins can be left floating.
[13] Pad provides special analog functionality.
[14] Pad provides special analog functionality.
[15] Pad provides special analog functionality.
[16] Pad provides special analog functionality.
[17] Pad provides special analog functionality.
VSS
15, 31,
41, 55,
72, 97,
83[13]
I
ground: 0 V reference.
VSSA
11[14]
I
analog ground: 0 V reference. This should nominally be the same voltage as
VSS, but should be isolated to minimize noise and error.
VDD(3V3)
28, 54,
71, 96[15]
I
3.3 V supply voltage: This is the power supply voltage for the I/O ports.
VDD(DCDC)(3V3)
13, 42,
84[16]
I
3.3 V DC-to-DC converter supply voltage: This is the supply voltage for the
on-chip DC-to-DC converter only.
VDDA
10[17]
I
analog 3.3 V pad supply voltage: This should be nominally the same voltage
as VDD(3V3) but should be isolated to minimize noise and error. This voltage is
used to power the ADC and DAC.
VREF
12[17]
I
ADC reference: This should be nominally the same voltage as VDD(3V3) but
should be isolated to minimize noise and error. Level on this pin is used as a
reference for ADC and DAC.
VBAT
19[17]
I
RTC pin power supply: 3.3 V on this pin supplies the power to the RTC
peripheral.
Table 3.
Pin description …continued
Symbol
Pin
Type
Description



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