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TLVM13630 Datasheet(PDF) 6 Page - Texas Instruments

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Part # TLVM13630
Description  TLVM13640 High-Density, 3-V to 36-V Input, 1-V to 6-V Output, 4-A Synchronous Buck DC/DC Power Module With Enhanced HotRod??QFN Package
PDF  40 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLVM13630 Datasheet(HTML) 6 Page - Texas Instruments

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7.3 Recommended Operating Conditions
Limits apply over TJ = –40°C to 125°C (unless otherwise noted).
MIN
NOM
MAX
UNIT
Input voltage
VIN (input voltage range after start-up)
3
36
V
Input voltage
VLDOIN
min (VVIN, 12)
V
Output voltage
VOUT(1)
1
6
V
Output current
IOUT(2)
0
4
A
Frequency
FSW set by RT
200
2200
kHz
Input current
PG
2
mA
Output voltage
PG
16
V
TJ
Operating junction temperature
–40
125
°C
TA
Operating ambient temperature
–40
105
°C
(1)
Under no conditions should the output voltage be allowed to fall below zero volts.
(2)
Maximum continuous DC current can be derated when operating with high switching frequency, high ambient temperature, or both.
Refer to the Typical Characteristics section for details.
7.4 Thermal Information
THERMAL METRIC(1)
RDL (QFN)
UNIT
20 PINS
RθJA
Junction-to-ambient thermal resistance (TLVM13660 EVM)
22.6
°C/W
RθJA
Junction-to-ambient thermal resistance (2)
33.1
°C/W
ψJT
Junction-to-top characterization parameter (3)
1
°C/W
ψJB
Junction-to-board characterization parameter (4)
12.3
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2)
The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 75-mm × 75-mm four-layer PCB with 2 oz.
copper and natural convection cooling. Additional airflow and PCB copper area reduces RθJA.
(3)
The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × PDIS + TT; where PDIS is the power dissipated in the device and TT is
the temperature of the top of the device.
(4)
The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × PDIS + TB; where PDIS is the power dissipated in the device and TB is
the temperature of the board 1mm from the device.
TLVM13640
SLVSGJ7 – APRIL 2022
www.ti.com
6
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