PCA9506DGG datasheet(27/30 Pages) PHILIPS

27 / 30 page

9397 750 14939

Product data sheet

Rev. 01 — 14 February 2006

27 of 30

Philips Semiconductors

PCA9506

40-bit I2C-bus I/O port with RESET, OE, and INT

• Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45

° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250

°C

or 265

°C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

16.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300

°C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270

°C and 320 °C.

16.5 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales ofﬁce.

Table 12:

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Package [1]

Soldering method

Wave

Reﬂow [2]

BGA, HTSSON..T [3], LBGA, LFBGA, SQFP,

SSOP..T [3], TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

not suitable [4]

suitable

PLCC [5], SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended [5] [6]

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended [7]

suitable

CWQCCN..L [8], PMFP [9], WQCCN..L [8]

not suitable

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