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TPS38 Datasheet(PDF) 51 Page - Texas Instruments |
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TPS38 Datasheet(HTML) 51 Page - Texas Instruments |
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51 / 53 page  NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. EXAMPLE BOARD LAYOUT 4225178/A 09/2019 www.ti.com WSON - 0.8 mm max height DSK0010C PLASTIC QUAD FLAT PACK- NO LEAD SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 20X EXPOSED METAL METAL SOLDER MASK OPENING 0.07 MAX ALL AROUND SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING 0.07 MIN ALL AROUND (1.2) (2) 2X (0.75) 2X (2) 8X (0.5) 10X (0.25) 10X (0.6) (2.3) (R0.05) TYP 5 1 10 6 (Ø0.2) VIA TYP 11 |
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