6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

PARAMETER

DEVICE

MIN

MAX UNIT

Peak pulse

ESD752

210

W

ESD752

5.7

A

Operating free-air temperature

-55

150

°C

Junction temperature

-55

150

°C

Storage temperature

-65

155

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings—JEDEC Specification

PARAMETER

TEST CONDITION

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001

± 2500

V

Charged device model (CDM), per JEDEC specification JS-002

± 1000

6.3 ESD Ratings—IEC Specification

PARAMETER

TEST CONDITION

DEVICE

VALUE

UNIT

Electrostatic discharge

IEC 61000-4-2 Contact Discharge, all pins

ESD752

±30000

V

IEC 61000-4-2 Air Discharge, all pins

±30000

6.4 Recommended Operating Conditions

PARAMETER

MIN

NOM

MAX

UNIT

Input voltage

−24

24

V

Operating free-air temperature

−55

150

°C

6.5 Thermal Information

THERMAL METRIC(1)

ESD752

ESD7x2

UNIT

DBZ (SOT-23)

DCK (SOT-323 / SC-70)

DBZ (SOT-23)

3 PINS

3PINS

3 PINS

Junction-to-ambient thermal resistance

291.5

283.0

TBD

°C/W

Junction-to-case (top) thermal resistance

147.1

164.1

TBD

°C/W

Junction-to-board thermal resistance

131.1

105.1

TBD

°C/W

Junction-to-top characterization parameter

32.0

67.1

TBD

°C/W

Junction-to-board characterization parameter

130.2

104.4

TBD

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

ESD752

SLVSGX0A – MAY 2022 – REVISED AUGUST 2022

www.ti.com

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