Symbol

Pin #

Circuit

All Input Circuits

AD_IN1

23

D

Circuit C

AD_IN2

24

D

AD_IN3

25

D

AD_IN4

26

E

AD_IN5

27

E

AD_IN6

28

E

AD_IN7

29

E

AD_IN8

30

E

AD_IN9

31

E

AD_IN10

32

E

AD_IN11

33

E

AD_IN12

34

E

Circuit D

AD_IN13

35

E

AD_IN14

36

E

AD_IN15

37

D

ADDR_SEL

38

A

AD_IN16/V

39

B

GND

40

B (Internally

shorted to

AGND.)

PWM1

41

A

PWM2

42

A

P1_VID0

43

A

P1_VID1

44

A

P1_VID2

45

A

Circuit E

P1_VID3

46

A

P1_VID4

47

A

P1_VID5

48

A

P1_PROCHOT

49

A

P2_PROCHOT

50

A

P2_VID0

51

A

P2_VID1

52

A

P2_VID2

53

A

P2_VID3

54

A

P2_VID4

55

A

P2_VID5

56

A

Note 4: Human body model, 100 pF discharged through a 1.5 k

Ω resistor. Machine model, 200 pF discharged directly into each pin. Charged device model (CDM)

simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged.

Note 5: Reflow temperature profiles are different for lead-free and non lead-free packages.

air flow is listed in the following table.

Air Flow

Junction to Ambient Thermal Resistance,

θ

JA

0 m/s

79 ˚C/W

1.14 m/s (225 LFPM)

62 ˚C/W

2.54 m/s (500 LFPM)

52 ˚C/W

Note 7: See the URL "http://www.national.com/packaging/" for other recommendations and methods of soldering surface mount devices.

Note 8: At the time of first pubication of this specification (Jan 2006), this specification applies to either Pentium or Xeon Processors on 90nm or 65nm process when

TruTherm is selected. When TruTherm is deselected this specification applies to an MMBT3904. This specification does include the error caused by the variability

of the diode ideality and series resistance parameters.

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