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L9788 Datasheet(PDF) 25 Page - STMicroelectronics

Part # L9788
Description  Multifunction IC for automotive engine management system
PDF  264 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L9788 Datasheet(HTML) 25 Page - STMicroelectronics

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DS12308 Rev 4
25/264
L9788
Absolute maximum ratings
263
2.3
Temperature ranges and thermal data
Note:
All parameters are tested in the temperature range Tj -40 - 150°C; device functionality at
high temperature is guaranteed by bench validation, electrical parameters are guaranteed
by correlation with ATE tests at reduced temperature and adjusted limits (if needed).
Temperature sensor present, please refer to Section 3.5.
Table 5. Pin classify
Pin classify
Global pin (ECU connector)
VB_IN VBAT_Sense VB_STBY VSENSE1/2 VESNSE3/4_MON
KEY_IN WK_IN MRD INJ1/2/3/4 O2H1/2 SOL1/2 RLY1/2/3/4/5
LED1/2 STR1/2/3_DRN STR1/2/3_SRC IGN1/2/3/4/5/6 LIN
PRD1/2/3/4/5_DRN
Direction pin (power and
I/O)
VDD_IO WDA SOE_OUT RSTN INJ_ENA MSC_EN MSC_CK_P
MSC_CK_N MSC_DI_P MSC_DI_N MSC_DO FLW_OUT
CURR_Sense_O2H1/2 PRD1/2/3/4/5_GATE EN_P EN_N LIN_TX
LIN_RX VDD5_IN CP EN_N EN_P
Local pins
VB_IN_SW Boost_G VPRE BUCK_SW Buck_C_BST VDD5_GATE
FLW_IN_P FLW_IN_N
GND pins
GND1 INJ1/2/3/4_PGND O2H1/2_PGND_A O2H1/2_PGND_B
GND
Table 6. Temperature ranges and thermal data
Pin
Symbol
Parameter
Test condition
Min
Typ
Max
Unit
-
Ta
Operating temperature
-
-40
-
125
°C
-
Tj
Junction temperature
-
-40
-
175
°C
-
Tstr
Storage temperature
-
-50
-
175
°C
-RTHj-c(1)
Thermal resistance
junction to case
--
1
-
°C/W
-RTHj-a(1)
Thermal Resistance
junction to ambient
supposing a mounting on
board 2s2p + heatsink vias
(refer to application note
for PCB parameters)
-10-
°C/W
1. With 2s2p PCB thermally enhanced, cold plate as per std Jedec best practice guidelines (JESD51), assuming Pdiss = 5 W
dissipated statically and homogeneously, thermal vias under package exposed pad assuming filling ratio 50% and 35 µm
vias diameter (157 vias estimation); refer to Figure 3: Thermal simulation set-up on page 26.



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