INA821 datasheet(4/52 Pages) TI

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6 Pin Configuration and Functions

IN–

G02+

OUT+

OUT–

IN+

G02–

Not to scale

Thermal Pad

Figure 6-1. RGT (16-Pin VQFN) Package, Top View

Table 6-1. Pin Functions

TYPE

DESCRIPTION

NAME

NO.

FDA_IN–

Input

Connection to output driver summing node.

FDA_IN+

Input

Connection to output driver summing node.

G02–

Input

Connection to gain network. Short to OUT– for output stage gain GOUT of 0.2 V/V.

G02+

Input

Connection to gain network. Short to OUT+ for output stage gain GOUT of 0.2 V/V.

IN–

Input

Negative (inverting) input.

IN+

Input

Positive (noninverting) input.

—

No connect

OUT–

Output

Negative Output

OUT+

Output

Positive Output

2,3

—

Gain setting pin. Place a gain resistor between pin 2 and pin 3.

VCLAMP–

Input

Level set for output clamp value. Connect either to an external supply that is at least 1.5 V

above VS– or connect to VS– if clamping function is not required.

VCLAMP+

Input

Level set for output clamp value. Connect either to an external supply that is at least 1.5 V

below VS+ or connect to VS+ if clamping function is not required.

VOCM

Input

Level set for output common mode value.

VS–

Power

Negative supply

VS+

Power

Positive supply

Thermal Pad

Thermal pad

—

The thermal pad must be soldered to the printed-circuit board (PCB). Connect thermal pad

to a plane or large copper pour electrically connected to the most negative supply or VS–.

INA851

SBOS999A – MARCH 2022 – REVISED OCTOBER 2022

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