AP62300/AP62301/AP62300T

Document number: DS41958 Rev. 3 - 2

19 of 23

www.diodes.com

January 2021

© Diodes Incorporated

AP62300/AP62301/AP62300T

Layout

PCB Layout

1.

The AP62300/AP62301/AP62300T works at 3A load current so heat dissipation is a major concern in the layout of the PCB. 2oz copper for

both the top and bottom layers is recommended.

2.

Place the input capacitors as closely across VIN and GND as possible.

3.

Place the inductor as close to SW as possible.

4.

Place the output capacitors as close to GND as possible.

5.

Place the feedback components as close to FB as possible.

6.

If using four or more layers, use at least the 2nd and 3rd layers as GND to maximize thermal performance.

7.

Add as many vias as possible around both the GND pin and under the GND plane for heat dissipation to all the GND layers.

8.

Add as many vias as possible around both the VIN pin and under the VIN plane for heat dissipation to all the VIN layers.

9.

See Figure 42 and Figure 43 for more details.

L

R2

R1

VIN

SW

GND

BST

EN

FB

VOUT

SW

GND

VIN

R1

L

GND

SW

VIN

FB

EN

BST

GND

VOUT

VIN

SW

Figure 42. Recommended PCB Layout, SOT563 (Standard)

Figure 43. Recommended PCB Layout, TSOT26 (Standard)