VCNL4040

www.vishay.com

Vishay Semiconductors

Rev. 1.7, 04-Nov-2020

17

Document Number: 84274

For technical questions, contact: sensorstechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RECOMMENDED INFRARED REFLOW

Soldering conditions which are based on J-STD-020 C

Recommend Normal Solder Reflow is 235 °C to 265 °C

Fig. 20 - VCNL4040 Solder Reflow Profile Chart

RECOMMENDED STORAGE AND REBAKING CONDITIONS

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

Storage temperature

5

50

°C

Relative humidity

60

%

Open time

168

h

Total time

From the date code on the aluminized envelope (unopened)

12

months

Rebaking

Tape and Reel: 60 °C

22

h

Tube: 60 °C

22

h

IR REFLOW PROFILE CONDITION

PARAMETER

CONDITIONS

TEMPERATURE

TIME

Peak temperature

260 °C + 5 °C / - 5 °C (max.: 265 °C)

10 s

Preheat temperature range and timing

150 °C to 200 °C

60 s to 180 s

Timing within 5 °C to peak temperature

10 s to 30 s

Timing maintained above temperature / time

217 °C

60 s to 150 s

Timing from 25 °C to peak temperature

8 minutes (max.)

Ramp-up rate

3 °C/s (max.)

Ramp-down rate

6 °C/s (max.)

200

150

217

260

Max. Temperature

260+5/-5

0C / 10 seconds

Soldering Zone

60-150 seconds

Time (second)

t2

t1

Ramp-up Rate

3

0C / seconds

(max)

Ramp-down Rate

6

0C / seconds

(max)

Ramp-up Rate

3

0C / seconds

(max)

Pre-Heating Time

t2 -t1 = 60 - 180 secons