www.ti.com

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

THERMAL

PAD

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

KFF

RT

BP5

SYNC

SGND

SS/SD

VFB

COMP

ILIM

VIN

HDRV

BPN10

SW

BP10

LDRV

PGND

(TOP VIEW)

TPS40060

TPS40061

SLUS543D–DECEMBER 2002–REVISED SEPTEMBER 2004

These devices have limited built-in ESD protection. The leads should be shorted together or the device

placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

LOAD CURRENT

PART NUMBER

Plastic HTSSOP (PWP)

TPS40060PWP

–40°Cto85°C

Plastic HTSSOP (PWP)

TPS40061PWP

(1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS40060PWPR). See the application

section of the data sheet for PowerPAD drawing and layout information.

(2) See Application Information section.

TPS40060

TPS40061

VIN

60 V

VFB, SS/SD, SYNC

–0.3 V to 6 V

Input voltage range

–0.3 V to 60 V or VIN+5 V

SW

(whichever is less)

SW. transient < 50 ns

–2.5 V

Output voltage range

COMP, RT, KFF, SS

–0.3 V to 6 V

Input current

KFF

5mA

Output current

RT

200 µA

Operating junction temperature range

–40°C to 125°C

Storage temperature

–55°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260°C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

MIN NOM MAX UNIT

Input voltage

10

55

V

Operating free-air temperature

–40

85

°C

(1) For more information on the PWP package, refer to TI Technical Brief (SLMA002).

(2) PowerPAD™ heat slug must be connected to SGND (Pin 5), or electrically isolated from all other pins.

2