LAND PATTERN RECOMMENDATION

11

LAND PATTERN RECOMMENDATION

0.28

1.7

R 2x0.3

0.8

6x0.5

Center Thermal Pad

PCB Land Pattern

Defined Pad

63% Printed

solder coverage

on thermal pad

Figure 9 · 8 Pin Plastic DFN 2x2mm Dual Exposed Pad Package Footprint

Disclaimer:

This PCB land pattern recommendation is based on information available to Microsemi by its suppliers. The actual land pattern to be used could be different depending on the

materials and processes used in the PCB assembly, end user must account for this in their final layout. Microsemi makes no warranty or representation of performance based

on this recommended land pattern.

PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is current

as of publication date. This document may not be modified in any way without the express written

consent of Microsemi. Product processing does not necessarily include testing of all parameters.

Microsemi reserves the right to change the configuration and performance of the product and to

discontinue product at any time.