ADG658 datasheet(20/20 Pages) AD

20 / 20 page

ADG658/ADG659

Rev. A | Page 20 of 20

PIN 1

SEATING

PLANE

0.010

0.004

0.012

0.008

0.025

BSC

0.010

0.006

0.050

0.016

8°

0°

COPLANARITY

0.004

0.065

0.049

0.069

0.053

0.154

BSC

0.236

BSC

COMPLIANT TO JEDEC STANDARDS MO-137AB

0.193

BSC

Figure 34. 16-Lead Shrink Small Outline Package [QSOP]

(RQ-16)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADG658YRU

−40°C to +125°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

ADG658YRU-REEL7

−40°C to +125°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

ADG658YCP

−40°C to +85°C

Lead Frame Chip Scale Package (LFCSP)

CP-16

ADG658YCP-REEL7

−40°C to +85°C

Lead Frame Chip Scale Package (LFCSP)

CP-16

ADG658YRQ

−40°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

ADG658YRQ-REEL

−40°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

ADG658YRQ-REEL7

−40°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

ADG659YRU

−40°C to +125°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

ADG659YRU-REEL7

−40°C to +125°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

ADG659YCP

−40°C to +85°C

Lead Frame Chip Scale Package (LFCSP)

CP-16

ADG659YCP-REEL7

−40°C to +85°C

Lead Frame Chip Scale Package (LFCSP)

CP-16

ADG659YCPZ1

−40°C to +85°C

Lead Frame Chip Scale Package (LFCSP)

CP-16

ADG659YCPZ-REEL71

−40°C to +85°C

Lead Frame Chip Scale Package (LFCSP)

CP-16

ADG659YRQ

−40°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

ADG659YRQ-REEL

−40°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

ADG659YRQ-REEL7

−40°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

1 Z = Pb-free part.

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C03273-0-7/04(A)

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