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DSPIC30F Datasheet(PDF) 247 Page - Microchip Technology |
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DSPIC30F Datasheet(HTML) 247 Page - Microchip Technology |
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247 / 248 page ![]() 2004 Microchip Technology Inc. Preliminary DS70083G-page 245 dsPIC30F PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Examples: a) dsPIC30F2011AT-E/SO = Extended temp., SOIC package, Rev. A. b) dsPIC30F5011AT-I/PT = Industrial temp., TQFP package, Rev. A. c) dsPIC30F3012AT-I/P = Industrial temp., DIP package, Rev. A. dsPIC30F4013AT-30I/ P-ES Trademark Architecture Flash E = Extended High Temp -40°C to +125°C I = Industrial -40°C to +85°C Temperature Device ID Package PT = TQFP 10x10 PT = TQFP 12x12 PF = TQFP 14x14 P= DIP SO = SOIC SP = SPDIP ML = QFN 6x6 or 8x8 S = Die (Waffle Pack) W = Die (Wafers) Memory Size in Bytes 0 = ROMless 1 = 1K to 6K 2 = 7K to 12K 3 = 13K to 24K 4 = 25K to 48K 5 = 49K to 96K 6 = 97K to 192K 7 = 193K to 384K 8 = 385K to 768K 9 = 769K and Up Custom ID (3 digits) or T = Tape and Reel A,B,C… = Revision Level Engineering Sample (ES) Speed 20 = 20 MIPS 30 = 30 MIPS |
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