6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

IIK

Input clamp current(2)

VI < 0 or VI > VCC

±20

mA

IOK

Output clamp current(2)

VO < 0 or VO > VCC

±20

mA

IO

Continuous output current

VO = 0 to VCC

±35

mA

ICC

Continuous current through VCC or GND

±70

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

2

6

V

VI

Input voltage

0

VCC

V

VO

Output voltage

0

VCC

V

TA

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

SN74HCS273

UNIT

RKS (VQFN)

PW (TSSOP)

DGS (VSSOP)

20 PINS

20 PINS

20 PINS

RθJA

Junction-to-ambient thermal resistance

83.2

134.9

130.6

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

82.6

74.6

68.7

°C/W

RθJB

Junction-to-board thermal resistance

57.4

86

85.4

°C/W

ΨJT

Junction-to-top characterization

parameter

14.5

22.5

10.5

°C/W

ΨJB

Junction-to-board characterization

parameter

56.4

85.6

85.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

40.0

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

SN74HCS273

SCLS851D – MARCH 2021 – REVISED JANUARY 2023

www.ti.com

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