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MPC8347E Datasheet(PDF) 60 Page - Freescale Semiconductor, Inc |
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MPC8347E Datasheet(HTML) 60 Page - Freescale Semiconductor, Inc |
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60 / 108 page ![]() MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3 60 Freescale Semiconductor Package and Pin Listings 18.2 Mechanical Dimensions of the MPC8347EA TBGA Figure 38 shows the mechanical dimensions and bottom surface nomenclature of the MPC8347EA, 672-TBGA package. Figure 38. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8347EA TBGA NOTES 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Parallelism measurement must exclude any effect of mark on top surface of package. |
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