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MPC8347E Datasheet(PDF) 98 Page - Freescale Semiconductor, Inc |
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MPC8347E Datasheet(HTML) 98 Page - Freescale Semiconductor, Inc |
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98 / 108 page  MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3 98 Freescale Semiconductor Thermal 20.3.1 Experimental Determination of the Junction Temperature with a Heat Sink When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimize the size of the clearance to minimize the change in thermal performance caused by removing part of the thermal interface to the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this case temperature, the junction temperature is determined from the junction to case thermal resistance. TJ = TC + (RθJC × PD) where: TJ = junction temperature (°C) TC = case temperature of the package (°C) RθJC = junction to case thermal resistance (°C/W) PD = power dissipation (W) |
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