MPC8347E datasheet(92/108 Pages) FREESCALE

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MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3

Freescale Semiconductor

Thermal

20 Thermal

This section describes the thermal specifications of the MPC8347EA.

20.1

Thermal Characteristics

Table 64 provides the package thermal characteristics for the 672 35

× 35 mm TBGA of the MPC8347EA.

Table 65 provides the package thermal characteristics for the 620 29

× 29 mm PBGA of the MPC8347EA.

Table 64. Package Thermal Characteristics for TBGA

Characteristic

Symbol

Value

Unit

Notes

Junction-to-ambient natural convection on single-layer board (1s)

RθJA

°C/W

1, 2

Junction-to-ambient natural convection on four-layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-ambient (@200 ft/min) on single-layer board (1s)

RθJMA

°C/W

1, 3

Junction-to-ambient (@ 200 ft/min) on four-layer board (2s2p)

RθJMA

8•C/W

1, 3

Junction-to-ambient (@ 2 m/s) on single-layer board (1s)

RθJMA

9•C/W

1, 3

Junction-to-ambient (@ 2 m/s) on four-layer board (2s2p)

RθJMA

7•C/W

1, 3

Junction-to-board thermal

RθJB

3.8

•C/W

Junction-to-case thermal

RθJC

1.7

•C/W

Junction-to-package natural convection on top

1•C/W

Notes

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal, 1 m/s is approximately equal to 200 linear feet per minute (LFM).

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Table 65. Package Thermal Characteristics for PBGA

Characteristic

Symbol

Value

Unit

Notes

Junction-to-ambient natural convection on single layer board (1s)

RθJA

°C/W

1, 2

Junction-to-ambient natural convection on four layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-ambient (@200 ft/min) on single layer board (1s)

RθJMA

°C/W

1, 3

Junction-to-ambient (@ 200 ft/min) on four layer board (2s2p)

RθJMA

•C/W

1, 3

Junction-to-board thermal

RθJB

6•C/W4

Junction-to-case thermal

RθJC

5•C/W5

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