QSMP

Layout Guidelines

Land pattern

See figure above for the suggested module layout. The

five 1mm pads in the square GND pad cutout can be

omitted if no JTAG Boundary Scan test is used. The

solder mask openings are shown below.

The ground pad solder mask on the bottom side of the

QSCOM module is divided into sections for a better

reliability of the solder joint and self-alignment of the

component.

If the via holes used on the application board have a

diameter larger than 0.3 mm, it is recommended to

mask the via holes to prevent solder wicking through

the via holes. Solders have a habit of filling holes and

leaving voids in the thermal pad solder junction, as well

as forming solder balls on the other side of the

application board which can in some cases be

problematic. The 0.7mm wide solder mask stripes can

be used to arrange the vias as shown here:

Ka-Ro electronics GmbH - Pascalstr. 22, D-52076 Aachen, Germany - Tel.: +49 2408 1402-0 (FAX -10)

www.karo-electronics.de