QSMP

QS Family

QFN Style Solder-Down

Computer-on-Modules

• Solder-down version

• 27mm square

• 2.3mm total height

• QFN type lead style

◦ 1mm pitch

◦ 100 pads

◦ Thermal pad

• Visual solder joint inspection possible after soldering

• Single-sided assembly

• High speed design compliant

• 3.3V power supply

Key Features

• Processor

STM32MP1 Series

Arm® Cortex®-A7 650MHz

Arm® Cortex®-M4 209MHz

• RAM

256MB or 512MB DDR3L

• ROM

4GB eMMC or 128MB SLC NAND

• Grade

Industrial

• Temperature

-25°C to 85°C (eMMC)

-40°C to 85°C (NAND)

• Display support

Display Interface

24-bit RGB

MIPI® DSI (2-lanes)*)

GPU*)

3D GPU: Vivante®,

OpenGL® ES 2.0

• Connectivity

◦ Gb Ethernet, USB2.0, eMMC/SD

◦ UART, I²C, SPI, PWM, SAI, CAN*)

OS Support

• Linux

*) Depends on SPM32MP1 version

Ka-Ro electronics GmbH - Pascalstr. 22, D-52076 Aachen, Germany - Tel.: +49 2408 1402-0 (FAX -10)

www.karo-electronics.de

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